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9th International Conference on Electrical and Electronics Engineering (ICEEE 2026) serves as a premier global forum dedicated to advancing research, innovation, and industrial applications across the full spectrum of Electrical and Electronics Engineering. The conference aims to bring together leading researchers, academicians, industry professionals, and practitioners to exchange knowledge, discuss emerging trends, and explore cutting edge developments shaping the future of the field.


ICEEE 2026 provides a dynamic platform for presenting original research contributions, breakthrough technologies, and stateoftheart reviews. The conference welcomes high quality submissions that highlight novel ideas, experimental results, theoretical advancements, and real world industrial experiences. Contributions may include research papers, case studies, survey articles, and project demonstrations that showcase significant progress in Electrical and Electronics Engineering.


Authors are invited to submit manuscripts that illustrate innovative methodologies, practical implementations, and impactful findings across a wide range of topics. Submissions may address, but are not limited to, the areas listed below, reflecting both foundational disciplines and emerging frontiers within the field.

Topics of interest
    Power, Energy & Control Systems

  • Smart Grids, Microgrids& Distributed Energy Systems
  • Renewable & Sustainable Energy Technologies
  • Power Electronics for Electric Vehicles & Transportation
  • Fast Charging Systems & Vehicle to Grid (V2G) Technologies
  • Energy Storage Systems & Battery Management
  • High Voltage Engineering & Protection Systems
  • Intelligent Control Systems & Automation
  • Power System Stability, Optimization & Resilience

    • Electronics, Circuits & Semiconductor Technologies

  • Analog, Mixed Signal & RF Circuit Design
  • High Performance Digital & Low Power Circuit Design
  • Nanoelectronics, 2D Materials & Emerging Semiconductor Devices
  • Neuromorphic, Spintronic & Quantum Devices
  • VLSI, SoC, NoC & Hardware Security
  • Electronic Packaging, Reliability & Thermal Management
  • Flexible, Printed & Organic Electronics
  • Electronic & Photonic Materials

    • Communication, Networking & Signal Processing

  • 5G/6G Wireless Systems & Beyond
  • Terahertz Communications & Reconfigurable Intelligent Surfaces (RIS)
  • Optical Communication & Photonic Integrated Circuits
  • Satellite, UAV & Space Communications
  • IoT, Edge Computing & Cyber Physical Systems
  • AI Driven Signal Processing & Communication Optimization
  • Network Security, Privacy & Blockchain Enabled Systems
  • Computational Imaging & Compressive Sensing

    • Electromagnetics, Antennas & Wave Engineering

  • Advanced Antenna Design (MIMO, mmWave, THz)
  • Metamaterials & Meta surfaces
  • Electromagnetic Compatibility (EMC/EMI)
  • Computational Electromagnetics & Wave Propagation

    • Embedded Systems, Robotics & Intelligent Machines

  • Embedded AI, TinyML & Real Time Systems
  • Robotics, Mechatronics & Autonomous Systems
  • Autonomous Navigation, SLAM & Sensor Fusion
  • Drones, UAV Navigation & Human Robot Interaction
  • Avionics & Aerospace Electronics
  • Cyber Physical Systems & Digital Twins
  • Industrial Automation & Smart Manufacturing
  • Embedded Security & Safety Critical Systems

    • Biomedical Engineering & Healthcare Technologies

  • Biomedical Instrumentation & Wearable Health Devices
  • Medical Imaging, Diagnostics & Bio signal Processing
  • Neural Engineering, Brain Machine Interfaces & Prosthetics
  • Bioelectronics, BioMEMS & LabonChip Systems
  • AI in Healthcare & Computational Biology (EEE aligned)

    • Sensing, Imaging & Remote Technologies

  • Advanced Sensor Technologies, MEMS/NEMS & Smart Sensing
  • LiDAR, Radar, Multispectral & Hyperspectral Imaging
  • Earth Observation, Remote Sensing & Geospatial Technologies
  • Virtual Instrumentation & Precision Measurement Systems

    • Computing, AI & Emerging Technologies

  • Machine Learning, Deep Learning & Generative AI for Engineering
  • Trustworthy AI, Explainable AI & Safe ML
  • Quantum Computing & Quantum Information Systems
  • Cloud, Edge & Distributed Computing Architectures
  • High Performance Computing & GPU/FPGA Acceleration
  • Evolutionary Algorithms, Swarm Intelligence & Optimization

    • Interdisciplinary & Frontier Technologies

  • Smart Cities, Intelligent Transportation & Infrastructure
  • Internet of BioNano Things (IoBNT)
  • Green Electronics & Sustainable Engineering
  • Space Electronics, Radiation Hardened Systems & Deep Space Instrumentation
  • AR/VR/MR Systems & Human Centered Computing
Paper Submission

Authors are invited to submit papers through the conference Submission System by February 14, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of nde conference will be published by International Journal on Cybernetics & Informatics (IJCI) (Confirmed).


Selected papers from ICEEE 2026, after further revisions, will be published in the special issue of the following journals


  • International Journal of Soft Computing, Mathematics and Control (IJSCMC)
  • Electrical Engineering: An International Journal (EEIJ)
  • Electrical and Electronics Engineering: An International Journal (ELELIJ)

    • Important Dates

    Third Batch : Submissions after January 31, 2026


    calendar_todaySubmission Deadline : February 14, 2026

    calendar_todayAuthors Notification : March 10, 2026

    calendar_todayRegistration & Camera-Ready Paper Due : March 17, 2026
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    CONFERENCE PROCEEDINGS

    Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on International Journal on Cybernetics & Informatics (IJCI) Proceedings.

    Speakers

    Ana Gonzalez-Marcos
    Universidad de La Rioja
    Spain

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    Reach Us

    emailiceee@iceee2026.org


    emailiceeeconf29@gmail.com

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